Huawei Unveils SuperPods: A New Era in AI Processing Power
Huawei has announced a series of groundbreaking releases in the AI chip sector. The tech giant will unveil its SuperPods, powered by the Ascend 950 series, starting with the Atlas 950 SuperPod in late 2026. This marks a significant leap in processing power, nearly seven times that of Nvidia's NVL144 system.
Huawei's journey begins with the TaiShan 950, the world's first general-purpose computing SuperPod, set to launch in 2026. Powered by the Kunpeng 950 processor, it promises unparalleled performance. The company plans to release two Kunpeng 950 variants, one with 96 cores and 192 threads, and another with 192 cores and 384 threads.
The Ascend 950 series will roll out in phases. The Ascend 950PR, supporting low-precision data formats like FP8, will be available in early 2026, delivering up to 2 PFLOPs of performance. Its successor, the Ascend 950DT, will follow in late 2026. The Ascend 960, slated for release in late 2027, will double the computing power, memory access bandwidth, and memory capacity of the Ascend 950, supporting Huawei's proprietary HiF4 data format. Looking ahead to late 2028, the Ascend 970 promises 8 PFLOPs of FP4 performance and enhanced memory capacity.
Huawei will also open-source its UnifiedBus 2.0 interconnection technology, enabling faster and more efficient communication between chips in SuperPods and SuperClusters.
Huawei's ambitious roadmap includes the release of three new Ascend chip series - 950, 960, and 970 - each pushing the boundaries of AI processing power. With the open-sourcing of its UnifiedBus 2.0 technology, Huawei aims to foster innovation in the AI chip sector, setting the stage for a new era in high-performance computing.
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